NEO Semiconductor develops 3D DRAM with AI processing — new tech eyes to replace current HBM tech to solve data bus bottlenecks

www.tomshardware.com

NEO Semiconductor develops 3D DRAM with AI processing — new tech eyes to replace current HBM tech to solve data bus bottlenecks

www.tomshardware.com

Alphane Moon@lemmy.worldM to

Hardware@lemmy.world · 3 months ago

Will the 3D X-AI chip reduce the massive power consumption of current data centers?

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